21 Jan 2010 --- A significant step towards eliminating the impact that packaging has on the environment is to be made with the launch of the c-Low mushroom punnet from Sharp Interpack. 

The carbon footprint of the punnet is 23% lower than conventional PP combining a substantial naturally resourced filler blended with UK stream post consumer waste - that's the c-LOW mushroom punnet.

When it comes to carbon footprints small is definitely beautiful and the latest development from Sharpak underpins the company's position as forerunner in pioneering new materials for recyclable packaging within innovative and creative designs.

c-LOW is a breakthrough in innovation and materials technology:

* Lowest carbon footprint punnet available
* UK-sourced post consumer waste
* 23% lower carbon footprint than standard PP
* Substantial natural mineral filler content
* Non plastic appearance
* Irresistibly tactile, soft to the touch
* Lowest virgin pertro-chemical content